The Process and Product Engineering group is part of the Operations team of the MEMS and Micro Devices Department within Philips Product Engineering and it consists of about 18 experts.
We focus on the continuous improvement of the existing and new technologies, processes and equipment used for the realization of integral (flowchart) solutions and low volume production in the application fields of MEMS, flexible devices, sensors, actuators, switches, harvesters for lighting, medical and semiconductor applications.
In this role, you have the opportunity to initiate and work on process engineering & development projects in the area of wafers bonding for integrated thin film applications, products and processes for internal and external customers with the purpose of delivering a base-line process.
– Leading the Wafers bonding cluster (process+equipment)
– Leading the wafer bonding different processes towards industry standards;
– Support wafers bonding process development;
– Interaction with Project Managers, Sales, Product Engineers and Operators/Technicians
You are responsible for:
o The wafer bonding cluster, maintaining and developing process and equipment industry standards
o The wafer bonding process engineering (Fusion, anodic, adhesive, eutectic)
o Writing and maintaining documentation supporting process engineering and work instruction transfer to Operations
o Application and development of processes, mostly within the context of a project.
o Participating in projects realizing the agreed deliverables, contributing or making relevant technological choices, during the different stages of the project for both Internal and external clients.
o Complying with the ESH policy, rules and regulations.
We welcome you to a challenging, innovative environment with great opportunities for you to explore and to develop yourself and your expertise.
We are looking for
To succeed in this role, you should have the following skills and experience
o A Master or Bachelor degree in the area of the exact sciences
o Relevant experience in Operations process engineering
o Knowledge of wafer bonding processing
o Strong analytical and problem solving skills, both technical as interpersonal.
o Knowledge of fundamental tools (DOE, SPC, Problem Solving, Teamwork, etc.), required in an engineering environment.
o Has a pragmatic and flexible attitude with a result driven can-do mentality
o Excellent communication skills, professional level of written and verbal communication in English
This role will appeal to you if you ….
• Enjoy working in cross-functional teams
• Have an affinity with innovative development projects to be lead towards manufacturing